GreenSource Fabrication announces exhibition at IMS 2026 (June 7-13, Boston) featuring advanced RF and microwave PCB manufacturing including PTFE, hybrid stackups, and controlled impedance for defense and 5G/6G applications.

Siemens announces expanded AI and intelligent automation in Xpedition PCB design platform, combining design reuse with connected data continuity to reduce layout time by 40-60% for complex boards.

The global AI edge devices PCB market is projected to surge from $15.4B in 2026 to $67.6B by 2033, driven by NPU-optimized stackups, HDI routing for on-device inference, and thermal management challenges unique to edge AI hardware.

Electroninks announces a breakthrough copper metal-organic decomposition (MOD) ink that cures in ambient air at 150°C, eliminating the need for nitrogen ovens in additive PCB metallization and enabling cost-effective copper patterning on flexible substrates.