PCB Assembly Service | SMT & DIP PCBA Manufacturer in Shenzhen

Our advanced PCB assembly equipment and mature manufacturing processes deliver outstanding technical capability, stable quality and high efficiency within the EMS industry.
We have certified IPC-A-610 trainers working alongside production operators to guarantee all assembled PCBs meet premium international quality standards.

SMT Basic Process:

Solder Paste Printing
Component Placement
Reflow Soldering
Board Rework & Repair

Our PCBA Advantages:

Strong engineering support: Front-end engineering & dedicated test engineering teams
Premium imported raw materials: We adopt Japanese KOKI solder paste and high-grade solder wire; refurbished/secondary raw materials are strictly prohibited
Rigorous quality control: Pre-reflow QC inspection, defect screening, and 100% post-reflow PCBA inspection
Comprehensive service system: Responsive customer support, on-time delivery with guaranteed quality to continuously fulfil customer requirements
Professional quality team: Experienced and well-trained quality control personnel
Raw material management: Complete incoming material verification before production launch

Complete PCBA assembly manufacturing process flow chart

Our one-stop manufacturing solution covers all your PCB assembly requirements:

Order Volume: No minimum order quantity available. Support engineering prototypes and low-volume first article builds
Component Procurement: Turnkey Service, Consigned/Kitted Materials, Partial Turnkey
Assembly Types: SMT, Through-hole DIP, Mixed SMT & Through-hole Technology, Single/Double-sided Component Placement, Fine Pitch Components

Flexible Circuit Assembly
Solder Process: RoHS-compliant Lead-free soldering, No-clean process optional
Inspection Equipment: 2D SPI, Pre-reflow AOI, Post-reflow SMT AOI, X-Ray Inspection
Testing Services: Functional Testing, Humidity Test, High & Low Temperature Cycling, Salt Spray Test, Vibration Test, Shock Test

Key Technical Specifications:
Stencil dimension range: 1560 × 450mm
Minimum SMT Component: 01005
Minimum IC Lead Pitch: 0.3mm
Maximum PCB Size: 1200 × 400mm
Minimum PCB Thickness: 0.35mm
Maximum BGA Size: 74 × 74mm
BGA Ball Pitch: 0.4 ~ 1.0mm
BGA Ball Diameter: 0.45 ~ 0.76mm
QFP Lead Pitch: 0.38 ~ 2.54mm

PCBA assembly technical capacity parameter overview

We operate 6 automated high-precision SMT production lines equipped with Panasonic and Samsung equipment. The production lines support components down to 0201, QFP ranging from 0.6mm×0.3mm up to 50mm×50mm with 0.15mm lead gap and ±0.05mm placement accuracy. Daily component mounting capacity reaches 11,000,000 placements.

Our engineering team possesses rich experience in DFM/DFA/DFT analysis.
We provide in-house BGA rework, re-balling and X-Ray inspection services. Laser-cut stencils can be manufactured and delivered within 4 hours.

Order Type	Standard Lead Time	Fast-Track Lead Time
Prototype (<20pcs)	2 days	12 hours
Small Batch (20–100pcs)	6 days	24 hours
Medium Batch (100–1000pcs)	5 days	48 hours
Mass Production (>1000pcs)	Subject to BOM availability	Subject to BOM availability

We deploy advanced testing technologies and reliable PCB assembly manufacturing services to deliver premium products for global customers, covering the full workflow from design verification to shipment.

Functional Testing

Comprehensive testing in new product development cuts clients’ costs and reduces production downtime. Early-stage ICT, AOI and Agilent 5DX inspections provide key feedback for timely revisions. Custom functional and application testing is conducted per customer requirements, followed by environmental stress screening to verify long-term reliability. Bestech’s full functional testing solutions enable first-pass production success and deliver products beyond client expectations.

Flying Probe Test (Fixtureless ICT)

AXI – 2D & 3D Automated X-Ray Inspection
AOI – Automated Optical Inspection
ICT – In-Circuit Test
ESS – Environmental Stress Screening
EVT – Environmental Verification Test
FT – Functional & System Test
Configure-to-order Assembly
Failure Analysis & Diagnostic Testing
Full PCBA Manufacturing & Test Solutions

ICT In-Circuit Comprehensive Testing

In-Circuit Testing (ICT) is widely adopted for mature products in electronic subcontract manufacturing. Bed-of-nails test fixtures access multiple test points on the bottom side of PCBs. With adequate test point coverage, ICT transmits high-speed test signals to evaluate individual components and circuit networks efficiently.