| Items |
Samples (PCB Prototypes) |
Capabilities (Mass Production) |
| Layer count |
1–30L |
1–16L |
| Board Thickness |
0.2–7.0mm |
0.4–6.0mm |
| Maximum Board Size |
610×100mm |
550×650mm |
| Copper Weight |
Inner Layer: 0.5–2 oz; Outer Layer: 0.5–3 oz
|
Inner Layer: 0.5–2 oz; Outer Layer: 0.5–2 oz
|
| Minimum Finished Hole Size |
0.1mm |
0.15mm |
| Hole Diameter Tolerance |
PTH: ±0.05mm; NPTH: ±0.05mm |
PTH: +0.075mm; NPTH: ±0.05mm |
| Maximum Aspect Ratio |
16:1 |
10:1 |
| Minimum Line Width |
3.0 mil |
4.0 mil |
| Minimum Line Spacing |
3.0 mil |
4.0 mil |
| Outline Dimension Tolerance |
±0.10mm |
±0.15mm |
| Maximum Allowable Bow & Twist |
0.50% |
0.75% |
| Solder Mask Color |
Green, Yellow, Black, Blue, Red, White, Purple |
Green, Yellow, Black, Blue, Red, White, Purple |
| Minimum Solder Mask Dam |
4mil(Green), 5mil(Other colors) |
4mil(Green), 5mil(Other colors) |
| Silkscreen Color |
White, Yellow, Black |
White, Yellow, Black |
| HASL Tin Thickness |
2–40μm |
2–40μm |
| Flash Gold (Electroplated Gold) |
Ni: ≥3μm; Au:0.025–0.1μm |
Ni: ≥3μm; Au:0.025–0.1μm |
| ENIG |
Ni: 3–8μm; Au:0.05–0.1μm |
Ni: 3–8μm; Au:0.05–0.1μm |
| Immersion Tin |
≥1.0μm |
≥1.0μm |
| Immersion Silver |
0.2–0.4μm |
0.2–0.4μm |
| OSP |
0.1–0.3μm |
0.1–0.3μm |
| Hard Gold |
0.1–0.4μm |
0.1–0.4μm |
| ENEPIG |
Ni:3–8μm; Pd:0.05–0.15μm;
Au:0.05–0.1μm
|
Ni:3–8μm; Pd:0.05–0.15μm;
Au:0.05–0.1μm
|
| Carbon Ink |
0.10–0.35μm |
0.10–0.35μm |
| Peelable Solder Mask |
0.2–0.50μm |
0.2–0.50μm |
| Raw Material |
FR-4, High Tg FR-4, Halogen-Free, PTFE, Aluminum Base
Material, Ceramic-Filled Laminates
|
FR-4, High Tg FR-4, Halogen-Free, PTFE, Aluminum Base
Material, Ceramic-Filled Laminates
|
| Surface Treatments Available |
Sn-Pb HASL, Lead-Free HASL, Flash Gold, ENIG, Immersion Tin,
Immersion Silver, OSP(Entek), Hard Gold, Soft Gold, ENIG+OSP,
ENIG+Gold Fingers, Hard Gold+Gold Fingers, Immersion
Silver+Gold Fingers, Immersion Tin+Gold Fingers, ENEPIG
|
Sn-Pb HASL, Lead-Free HASL, Flash Gold, ENIG, Immersion Tin,
Immersion Silver, OSP(Entek), Hard Gold, Soft Gold, ENIG+OSP,
ENIG+Gold Fingers, Hard Gold+Gold Fingers, Immersion
Silver+Gold Fingers, Immersion Tin+Gold Fingers, ENEPIG
|