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PCB cost depends on several factors, including:
  • Number of layers
  • Panelization efficiency
  • Number of drilled holes
  • Number of hole sizes (tool changes slow down production)
  • PCB laminate material (choosing the right material can save cost for volume production)
  • Trace width and part spacing (impacting manufacturing yield)
  • Special requirements, such as controlled impedance, via-in-pad, blind/buried vias, microvias, etc., which can affect yield and complexity.
10 pieces
Yes, we specialize in prototype and low-volume PCB production.
Absolutely. Your files are confidential. We require written consent to share or reproduce them and can sign an NDA upon request.Absolutely. Your files are confidential. We require written consent to share or reproduce them and can sign an NDA upon request.
Standard production runs are 5–7 days, with expedited options available.
We offer 24-hour quick-turn prototypes.
HASL, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Hard Gold, and Soft Gold, and more.
We offer green, black, blue, red, yellow, purple, and white solder masks.
We use high-quality green Liquid Photo Imageable (LPI) solder mask for our PCB production.
We can offer 0.5 oz, 1.0 oz, 1.5 oz, 2.0 oz, 2.5 oz, 3.0 oz, and Heavy Copper PCB options at 3.5 oz, 4.0 oz, 4.5 oz, and 5.0 oz.
0.3mm, 0.4mm 0.6mm 0.8mm 1.0mm 1.2mm 2.0mm 2,4mm ,3.0mm 3.2mm 4mm, 6mm
Our standard laminate thickness is 1.6 mm (0.063").
Yes, overlapping drills are supported.
Yes, included at no extra cost.
We work with FR-4, Rogers, Polyimide, Aluminum Thermal Clad, ISOLA, Taconic, Arlon, NAN-YA and more. Finishes include ENIG, Immersion Silver, Immersion Tin, OSP, HAL (lead-free or leaded), soft bondable gold, and ENIPEG.
Laser-drilled holes down to 0.004″, mechanical holes to 0.005″. Trace/space as low as 0.003″, depending on copper weight.Laser-drilled holes down to 0.004″, mechanical holes to 0.005″. Trace/space as low as 0.003″, depending on copper weight.
Yes, we manufacture HDI boards with laser-drilled microvias. Learn about HDI
We build up to 40 layers.
Design Requirements:
Via-on-pad: Must be resin-filled for reliable soldering.
Via-near-pad: Must be tented/solder-mask-filled to prevent defects.
We ensure high-quality BGA assembly through strict process controls.
Yes. This practice is called partial Turn-key. You can supply some parts, and we source the rest of the parts on your behalf. We will ask for your approval for anything that is not sure at our side. In case parts crossing or substitution is needed, we will again ask for your final approval.
SMT Assembly involves the following
Application of solder paste
Placing the components
Soldering the boards with a reflow process.
The total lead time depends on component procurement and PCB assembly. To optimize efficiency, we overlap processes: once we receive your Gerber files and BOM, we begin stencil preparation and PCB fabrication in parallel with parts sourcing.
We order components in bulk if they are common and out of stock. For standard parts we typically keep in inventory, you pay little or nothing.
For uncommon BOM items, we procure a 5% overage or 5 spare parts (based on size/cost) to prevent shortages due to production loss—covered at our cost, so you incur no extra charges.
If any BOM issues arise (e.g., high MOQs), we’ll collaborate on solutions. Our 35-member sourcing team ensures 24-hour to 7-day quotes (depending on BOM complexity) and procures parts globally, leveraging long-term local supplier relationships (10+ years) and international channels for competitive pricing.
We can process Gerber RS-274X and ODB++ files.

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